- General Information
- Manufacturer
- Intel Corporation
- Manufacturer Website Address
- http://www.intel.com
- Brand Name
- Intel
- Product Line
- Xeon Platinum
- Package Type
- OEM
- Product Type
- Processor
3rd Generation Intel® Xeon® Scalable Processors
Introducing 3rd Gen Intel Xeon Scalable processors, a balanced architecture with built-in acceleration and advanced security capabilities, designed through decades of innovation for the most in-demand workload requirements.
Through partnership with the world's software leaders and solution providers, 3rd Gen Intel Xeon Scalable processors are optimized for many workload types and performance levels, all with the consistent, open Intel architecture you know and trust.
Intel® Xeon® Platinum Processor
Intel® Xeon® Platinum Processor are the foundation for secure, agile, data centers. With built-in AI acceleration, advanced security technologies, and exceptional multi-socket processing performance, these processors are built for mission-critical, real-time analytics, machine learning, artificial intelligence, and cloud workloads.
With trusted, hardware-enhanced data service delivery, these processors deliver improvements in I/O, memory, storage, and network technologies to harness actionable insights from our increasingly data-fueled world.
Designed for advanced analytics, artificial intelligence, and high-density infrastructure, Intel® Xeon® Platinum 8300 processors deliver exceptional performance, platform capabilities, and workload acceleration from edge to cloud.
Features and Benefits
- Only Data Center CPU with Built-in AI Acceleration
- Intel® Optane™ Persistent Memory
- Advanced Security Technologies
- Technical Information
- Processor Manufacturer
- Intel
- Processor Core
- Hexatriaconta-core (36 Core)
- Clock Speed
- 2.10 GHz
- Overclocking Speed
- 3.50 GHz
- L3 Cache
- 54 MB
- 64-bit Processing
- Yes
- Process Technology
- 10 nm
- Processor Threads
- 72
- Processor Socket
- Socket LGA-4189
- Processor Generation
- 3rd Gen
- Power Description
- Thermal Design Power
- 195 W
- Environmental Conditions
- Thermal Specification
- 172.4°F (78°C)
- Physical Characteristics
- Width
- 3.1"
- Depth
- 2.2"
- Miscellaneous
- Compatibility
Intel® C620 Series Chipsets
Intel® C629A Chipset
Intel® C627A Chipset
Intel® C621A Chipset